OG Electrolab is a leading company in the field of electronic device and solution manufacturing, operating with modern equipment and high quality standards. Our company specializes in the production of high-tech products using advanced assembly methods such as surface-mount technology (SMT), ensuring precision and reliability of the final product.
Equipped with state-of-the-art SMT lines with a capacity of up to 80,000 components per hour, OG Electrolab is capable of handling the most complex manufacturing tasks of any scale. We exercise strict quality control at every stage of production—automated optical inspection and X-ray control enable us to meet high international standards.
Striving for a high level of reliability and safety, we automate key technological processes and implement modern cleaning and control systems.
OG Electrolab is a reliable partner that combines innovation, quality, and efficiency to deliver our clients’ most ambitious projects.
- 01
Surface-Mount Technology (SMT)
Surface-mount technology is an advanced electronic assembly method in which components are placed and fixed directly onto the surface of printed circuit boards using automated lines. This approach significantly increases component density, reduces device dimensions, and accelerates production processes. Advantages of SMT: • High automation and productivity• Compact and lightweight devices• Improved assembly quality and […]
- 02
Through-Hole Assembly
Through-hole assembly is a technology in which components with leads—such as connectors, capacitors, resistors, and other passive and active elements—are installed on printed circuit boards by soldering the leads into specially prepared holes or in combination with surface-mount technology. Key features: • Used for installing connectors, leaded components, and large devices• Suitable for both prototypes […]
- 03
Cleaning
To ensure high-quality cleaning of printed circuit boards, we use the modern automatic conveyor jet cleaning system DCT InJet TWIN 388 CRR. This system effectively removes solder paste residues, contaminants, and impurities from board surfaces, ensuring perfect cleanliness and readiness for subsequent assembly or inspection stages. Key advantages: • High automation and productivity — enables […]
- 04
Enclosure Assembly and Component Fixation
Enclosure assembly is a critical stage in electronic device manufacturing, providing protection of internal electronics from external influences and ensuring operational reliability. Key processes: • Conformal coating — application of a protective layer that prevents corrosion, mechanical damage, and improves the product’s appearance• Enclosure assembly — installation and assembly of all components into a robust […]
- 05
Product Testing
As part of the production process, all electronic modules undergo mandatory testing in accordance with the design documentation specified by the customer. This stage includes verification of functionality, electrical parameter compliance, reliability, and the quality of soldered connections. Key features: • Compliance with technical requirements — all parameters are tested against customer specifications• Use of […]
- 06
Product Quality Control
OG Electrolab has implemented an advanced quality control system using high-tech equipment: • X-ray inspection — detailed analysis of internal structures of multilayer boards, identifying hidden defects such as short circuits, insufficient solder joints, and internal layer damage• Automated Optical Inspection (AOI) — fast and accurate detection of surface defects, including incorrect component placement, missing […]
